PGA(Pin Grid Array)
- PGA is used in 5th Genration processors.
- PGA is rectangular or square in shape mount in PCB(Printed circut Board).The pins are usually 2.54 mm apart (0.1") and can cover the whole underneath of the package.
- PGA has large width Data Bus as compare to DIP(Dual inline Package).
- PGA starts with Intel 80286 microprocessors.
- PGA is in Plastic Packageing layout with organic plate.
What is PGA(Pin Grid Array)
- The biggest advantage is the number of pin are maximum as compare to DIP so that the more connection are established.
- PGA is less reliable due to number of maximum pin makes limitation on electrical capabilities.
- PGA is cheaper then other Grid.
- Depending on the size and complexity of the IC, the array may form a number of parallel rows of pins on two opposite sides of the package or around all 4 sides.
Thank you so much for reading the What is PGA(Pin Grid Array) packaging.
Know about the more packaging in detail click in given link.
- DIP (Dual Inline Packaging).Click Here
- SGPA (Staggerd Pin Grid Array).Click Here
- MCM (Multi Chip Module).Click Here
- LCC (Leadless Chip Carrior).Click Here
- PLCC (Plastic Leaded Chip Carrior).Click Here
- TC (Tape Carrior).Click Here
- CPU Packaging in detail.Click Here
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