CPU Packaging in Detail / Explaination of DIP,PGA,SPGA,MCM,LCC,PLCC & Tape Carrier packaging.

CPU Packaging

• CPU packaging  is used for control damage of the processor.

• A protective exterior packaging is supplied to the actual microprocessor and its associated electronic circuits. It's the packaging you see when looking at a processor, not the microprocessor. The packaging of the manufacturer is typically ceramic or plastic.

• The external coverage of the processor protects its core (also known as the die) containing the microchip and the cable connected to the mounting pins of the processor. There have been a number of packaging types used in processors.

• Several different packaging designs for the CPU chip die were used during development time of the computer. There are advantages and inconveniences of each type of packaging. The LGA (Land Grid Array) package contains the most advanced CPUs today, however, some common packages can still be reviewed. 

• The packaging structure links the processor's slot to the motherboard interface. 

Processor Die :

Processor die is a single continuous piece of semi-conductor material (usually silicon). A die may contain a number of cores. Up to 15 are available in the Intel product line. Processor die is where the transistors that make up the CPU actually reside. 

Type of Packaging :

1. DIP (Dual Inline Packaging).Click Here
2. PGA (Pin Grid Array).Click Here
3. SGPA (Staggerd Pin Grid Array).Click Here
4. MCM (Multi Chip Module).Click Here
5. LCC (Leadless Chip Carrior).Click Here
6. PLCC (Plastic Leaded Chip Carrior).Click Here
7. TC (Tape Carrior).Click Here

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