What is MCM(multi chip module)?

MCM(multi chip module)

• A multi Chip Module (MCM) is usually an electronic component, with the integration of multiple integrated circuits, semiconductor dies, and/or other discrete components usually on a unifying suspension, so it is treated as a single component (as if it were a larger component) in use.

• A multi chip module (MCM) is a multifaceted, integrated circuit (IC) package assembled in one device.

• MCMs are more efficient and can significantly reduce the size of a device.

• MCM improves performance as the interconnection length between the dies is reduced, also with the Lower Power Induction.

• MCM has lower load capacity and less crosstalk.

• MCM has lower power off - chip driver and smaller size. 

• MCM low cost silicon sweeping and reliability improved.

• Increased flexibility, as well as simplified design and complexity in the case of several components being packaged in one device, in order to integrate various semiconductor technology.

• A new development called MCM chip - stack allows vertical configuration of dies with identic pinouts, which enables further miniaturization, making them suitable for use in personal digital assistants and mobile phones.

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1. DIP (Dual Inline Packaging).Click Here
2. PGA (Pin Grid Array).Click Here
3. SGPA (Staggerd Pin Grid Array).Click Here
4. LCC (Leadless Chip Carrior).Click Here
5. PLCC (Plastic Leaded Chip Carrior).Click Here
6. TC (Tape Carrior).Click Here
7. CPU Packaging in detail.Click Here